Copper foil annealing
Continuous annealing for thin copper foil used in conductive and precision applications.
Copper Foil Annealing
Copper Foil Annealing Furnace
Continuous annealing solution for copper foil processing, designed for thin material handling, low surface oxidation, controlled cooling and stable electrical conductivity.
copper foil annealing furnace Copper foil annealing high surface quality low-tension handling
Application
For thin copper foil that needs gentle continuous annealing.
Copper foil annealing is sensitive to tension, temperature variation and cooling shock. AKS designs the line around stable transport, protective atmosphere and controlled thermal profile.
Clean Bright Surface
Clean atmosphere control helps reduce oxidation and discoloration on foil surfaces.
Shape Control
Low-tension handling and cooling control reduce wrinkles, deformation and break risk.
Technical Parameters
| Material | Copper foil and thin copper alloy strip |
|---|---|
| Process | Continuous copper bright annealing under protective atmosphere |
| Handling focus | Low tension, smooth transport and controlled speed transition |
| Surface target | Bright and clean copper foil surface with reduced oxidation risk |
| Cooling target | Controlled cooling to protect shape and conductivity stability |
| Automation | Temperature records, alarm logic, HMI and production data tracking |
Foil Stability
Protect the foil while keeping the annealing result repeatable.
- Stable line transport reduces wrinkle and break risk during continuous production.
- Atmosphere control supports copper bright annealing without surface darkening.
- Cooling control reduces thermal stress and helps maintain foil shape.
